Technology-New Technology Outsource stays as far ahead of the technology curve as possible - that goes for both equipment and processes. As new advancements such as miniaturization, reliability of contact, or speed of assembly shape the technological landscape, you need a manufacturing services partner who can adapt to support these new technologies. In addition to upgrading our standard assembly equipment regularly, Outsource Manufacturing continues to be an early adapter of newer technologies, even prior to their complete acceptance in the industry. This openness to new technologies gives us the experience to handle your most complex manufacturing needs. BGA Technologies: Perfecting The Reworking Process Reworking the boards is an unavoidable necessity in electronic assembly. While we incorporate quality procedures which aim for zero-defects, we understand the importance of having rework capabilities, and make available to our customers the most advanced BGA technologies to promote efficient and timely reworking. X-ray stations allow for early identification of hidden defects, including solder bridging, missing solder balls, solder voiding and misalignment, while also allowing us to review rework boards immediately. Additionally, our automated rework station facilitates the safe removal of those complex and expensive functional components for reuse. Flip Chip Technologies: The Future Of Electronics Manufacturing The current direction of the electronics industry points toward smaller, thinner and faster electronics products. The market is demanding more user-friendly features, increased functionality, higher performance, and extended reliability - while also demanding lower prices. One of the solutions to meeting these demands is Flip-Chip technology. Flip chip technology involves the attachment of silicon chips directly to the circuit boards without requiring a wire bonding process. Flip chip or face-down soldering uses a solder bump at all the die pad locations to make the electrical and mechanical interconnect between the die and the substrate. Flip chip is currently being pursued because, unlike other assembly methods, it is extendable to meet the requirements of future high-performance chips. This technology has some very attractive advantages. Flip chip connections are arranged over the entire area of the die. Consequently the I/Os can be arranged over the entire area of the substrate, creating much higher densities and new design possibilities for interconnected professionals. You can count on Outsource to support these new technologies as they continue to evolve.