Technology We support all electronic assembly technologies including SMT, TH, Flip Chip, BGA/Micro BGA with multiple X-ray inspection stations for BGA processes. We are backed by Fuji inline SMT machines, including new Fuji VIIs capable of inserting 0201 components. We offer a dedicated prototype area with special assembly personnel experienced in quick set-up and short runs. Screens and programming are complete within hours so the turnaround is as quick as it takes to complete the materials kit. Actual touch time is minimal, therefore one day to a few day's turnaround is standard.